Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU Support and Manuals
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Popular Intel 640 Manual Pages
User Guide - Page 2
...of others
Copyright © 2004-2005 Intel Corporation
2
Thermal/Mechanical Design Guide
Intel, Pentium, and the Intel logo are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in the 775-Land LGA Package may be claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device...
User Guide - Page 4
... for the Intel® Pentium® 4 Processor
in the 775-Land LGA Package 46
5.7 Reference Attach Mechanism 48
5.7.1 Structural Design Strategy 48 5.7.2 Mechanical Interface to the Reference Attach Mechanism 49
Acoustic Fan Speed Control 53
6.1 Acoustic Fan Speed Control 53
6.2 Thermal Solution Design 53 6.2.1 Compliance to Thermal Profile 53 6.2.2 Determine Thermistor Set Points 53...
User Guide - Page 5
... Material Area 73 C.3 Interface Material Performance 73
Appendix D
Case Temperature Reference Metrology 75
D.1 Objective and Scope 75 D.2 Definitions...75 D.3 Supporting Test Equipment 76 D.4 Thermal Calibration and Controls 77 D.5 IHS ... Thermal Considerations 91
Appendix G Mechanical Drawings...93
Appendix H Intel Enabled Reference Solution Information 105
Thermal/Mechanical Design...
User Guide - Page 6
... 92 Figure 45. Sheet 2 95 Figure 47. Sheet 3 96
6
Thermal/Mechanical Design Guide Processor Case Temperature Measurement Location 19 Figure 3. Example Acoustic Fan Speed Control Implementation 55 Figure 18. Temperature Range = 10 °C 58 Figure 21. Preload Test Configuration 69 Figure 27. 775-Land LGA Package Reference Groove Drawing 78 Figure 28. Detailed Thermocouple Bead...
User Guide - Page 8
... Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors 571, 561, 551...
User Guide - Page 10
... and metrology recommendations to "the processor" and/or "the Pentium 4 processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. REFER TO THE DATASHEET FOR THE PRODUCT DIMENSIONS, THERMAL POWER DISSIPATION AND MAXIMUM CASE TEMPERATURE. In this document, when a reference...
User Guide - Page 11
...
References
Material and concepts available in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Document
Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme Edition Datasheet - Integration Video
Fan Specification for 4-wire PWM Controlled Fans
Performance ATX...
User Guide - Page 12
...: Heat source must be expressed as a dimension away from the on the underside of the fins to keep the processor die temperature within factory specifications.
Thermal Design Power: a power dissipation target based on the Pentium 4 processor in the 775- The surface mount socket designed to TC.
Thermal Monitor
A feature on worst-case applications.
The maximum case...
User Guide - Page 15
... surface mounting to the processor datasheet for detailed mechanical specifications. Package IHS Load Areas
Substrate
Top Surface of the socket with the motherboard via a LGA775 socket. Processor Thermal/Mechanical Information
R
2 Processor Thermal/Mechanical Information
2.1
Mechanical Requirements
2.1.1
Processor Package
The Pentium 4 processor is packaged in a 775-land LGA package...
User Guide - Page 17
...with the Intel reference design...Socket Mechanical Design Guide for further ...temperature cycling. Their design should create a static preload on mechanical design, in applied pressure over time when designing the clip and fastener to support the Pentium 4 processor in Section 5.7. This means that must support...775-land LGA package should provide a means for the heatsink developed to the...
User Guide - Page 19
... for a specific processor. The Platform Requirement Bit (PRB) indicates which thermal profile is 61 °C. This document will focus on the PRB. This performance
is required.
Thermal/Mechanical Design Guide
19 By design the thermal solutions must meet the thermal profile for all system operating conditions and processor power levels. Processor Case Temperature Measurement...
User Guide - Page 30
...Processor Case Temperature Measurement Guidelines
The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, errors.../Mechanical Design Guide
Before any temperature measurements are often used to measure TC. When measuring the temperature of a 775-land LGA processor package for TC...
User Guide - Page 33
... Guide
33 Thermal Management Logic and Thermal Monitor Feature
R
Figure 7.
During the boot process, the BIOS must be configured and monitored in an MSR (model specific register). Refer to monitor the processor thermal status. The Thermal Control Circuit feature can also be activated manually using various registers and outputs to Section 4.2.4 for special software drivers...
User Guide - Page 34
... is referred to the thermal design power (TDP).
System Considerations
Intel requires the Thermal Monitor and Thermal Control Circuit to 87.5%. The processor TDP is used to determine those applications that are used simultaneously, the fixed duty cycle determined by setting bits in the processor datasheet. This data is based on -demand" mode. Systems that...
User Guide - Page 39
... temperature to support processors with PRB=1. 3. By minimizing TR, in the 775-land LGA package. Thermal/Mechanical Design Guide
39 Meeting TA and ΨCA targets can maximize processor performance (refer to improved acoustics.
Table 2. ATX Reference Heatsink Performance Target
Processor Number
Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630
Intel...
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