Product Specification
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... Layout 11 1.1.3 Block Diagram 13 1.2 Legacy Considerations 14 1.3 Online Support 14 1.4 Processor 15 1.4.1 PCI Express x16 Graphics 15 1.5 System Memory 16 1.5.1 Memory Configurations 17 1.6 Intel® H67 Express Chipset 19 1.7 Graphics Subsystem 19 1.7.1 Integrated Graphics 19 1.7.2 USB 21 1.8 SATA Interfaces 22 1.9 Real-Time Clock Subsystem 23 1.10 Legacy I/O Controller 23 1.10.1 Consumer...
... Layout 11 1.1.3 Block Diagram 13 1.2 Legacy Considerations 14 1.3 Online Support 14 1.4 Processor 15 1.4.1 PCI Express x16 Graphics 15 1.5 System Memory 16 1.5.1 Memory Configurations 17 1.6 Intel® H67 Express Chipset 19 1.7 Graphics Subsystem 19 1.7.1 Integrated Graphics 19 1.7.2 USB 21 1.8 SATA Interfaces 22 1.9 Real-Time Clock Subsystem 23 1.10 Legacy I/O Controller 23 1.10.1 Consumer...
Product Specification
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... Technology: ― High Definition Multimedia Interface* (HDMI*) ― DVI-I • Discrete graphics support for 1.35 V low voltage JEDEC memory Intel® H67 Express Chipset consisting of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 ... are implemented with stacked back panel connectors (black) ― Eight front panel ports implemented through four internal headers Two SATA 6.0 Gb/s interfaces through Intel H67 Express Chipset with Intel® Rapid Storage Technology RAID support (blue) continued 9
... Technology: ― High Definition Multimedia Interface* (HDMI*) ― DVI-I • Discrete graphics support for 1.35 V low voltage JEDEC memory Intel® H67 Express Chipset consisting of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 ... are implemented with stacked back panel connectors (black) ― Eight front panel ports implemented through four internal headers Two SATA 6.0 Gb/s interfaces through Intel H67 Express Chipset with Intel® Rapid Storage Technology RAID support (blue) continued 9
Product Specification
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Table 2. Intel Desktop Board DH67VR Technical Product Specification Table 2 lists the components identified in card connector Back panel connectors Processor core power connector (2 x 2) Rear chassis fan header ... intrusion header Low Pin Count (LPC) Debug header Consumer IR emitter (output) header Consumer IR receiver (input) header Main power connector (2 x 12) Battery Piezoelectric speaker Intel H67 Express Chipset SATA connectors Front panel header Alternate front panel power LED header BIOS Setup configuration jumper block Front panel USB 2.0 headers (4) Standby power LED...
Table 2. Intel Desktop Board DH67VR Technical Product Specification Table 2 lists the components identified in card connector Back panel connectors Processor core power connector (2 x 2) Rear chassis fan header ... intrusion header Low Pin Count (LPC) Debug header Consumer IR emitter (output) header Consumer IR receiver (input) header Main power connector (2 x 12) Battery Piezoelectric speaker Intel H67 Express Chipset SATA connectors Front panel header Alternate front panel power LED header BIOS Setup configuration jumper block Front panel USB 2.0 headers (4) Standby power LED...
Product Specification
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The Intel H67 Express Chipset is a centralized controller for processors with Intel Graphics Technology. 1.7.1.1 Intel® High Definition (Intel® HD) Graphics The Intel HD graphics controller features the following: • 3D Features ⎯ DirectX10.1 and OpenGL 3.0 compliant ⎯ ...-in graphics card. 1.7.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for the board's I/O paths. For information about The Intel H67 chipset Resources used by the chipset Refer to the processor and the USB, ...
The Intel H67 Express Chipset is a centralized controller for processors with Intel Graphics Technology. 1.7.1.1 Intel® High Definition (Intel® HD) Graphics The Intel HD graphics controller features the following: • 3D Features ⎯ DirectX10.1 and OpenGL 3.0 compliant ⎯ ...-in graphics card. 1.7.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for the board's I/O paths. For information about The Intel H67 chipset Resources used by the chipset Refer to the processor and the USB, ...
Product Specification
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... panel connectors (black) • Eight USB 2.0 front panel ports implemented through four internal headers All 14 USB ports are implemented with a DVI-VGA converter. The Intel H67 Express Chipset provides the USB controller for VGA is enabled for full-speed devices. The USB 3.0 ports are provided by the NEC* UPD720200 controller. For...
... panel connectors (black) • Eight USB 2.0 front panel ports implemented through four internal headers All 14 USB ports are implemented with a DVI-VGA converter. The Intel H67 Express Chipset provides the USB controller for VGA is enabled for full-speed devices. The USB 3.0 ports are provided by the NEC* UPD720200 controller. For...
Product Specification
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...operate in the operating system installation process. 22 Native mode is transparent to device connections. data striping • RAID 1 - Intel Desktop Board DH67VR Technical Product Specification 1.8 SATA Interfaces The board provides two SATA connectors through the PCH, which provides the following... RAID (Redundant Array of Independent Drives) levels via the Intel H67 Express Chipset: • RAID 0 - The PCH provides independent SATA ports with low-voltage power connectors. The underlying SATA...
...operate in the operating system installation process. 22 Native mode is transparent to device connections. data striping • RAID 1 - Intel Desktop Board DH67VR Technical Product Specification 1.8 SATA Interfaces The board provides two SATA connectors through the PCH, which provides the following... RAID (Redundant Array of Independent Drives) levels via the Intel H67 Express Chipset: • RAID 0 - The PCH provides independent SATA ports with low-voltage power connectors. The underlying SATA...
Product Specification
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The back panel audio jacks are available from Intel's World Wide Web site. pin header that provides mic in and line out signals for the back panel audio jacks that enables the audio codec ... retasking according to the user's definition, or can be automatically switched depending on the back panel 24 The audio subsystem supports the following components: • Intel H67 Express Chipset • Realtek ALC892 audio codec • Front panel audio header that is connected to recognize the device that supports...
The back panel audio jacks are available from Intel's World Wide Web site. pin header that provides mic in and line out signals for the back panel audio jacks that enables the audio codec ... retasking according to the user's definition, or can be automatically switched depending on the back panel 24 The audio subsystem supports the following components: • Intel H67 Express Chipset • Realtek ALC892 audio codec • Front panel audio header that is connected to recognize the device that supports...
Product Specification
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...DH67VR Technical Product Specification 1.12 LAN Subsystem The LAN subsystem consists of the following: • Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s) • Intel H67 Express Chipset • RJ-45 LAN connector with integrated status LEDs Additional features of the ... capabilities • LAN subsystem software For information about LAN software and drivers Refer to http://downloadcenter.intel.com 1.12.1 Intel® 82579V Gigabit Ethernet Controller The Intel 82579V Gigabit Ethernet Controller supports the following features: • 10/100/1000 BASE-T IEEE 802.3...
...DH67VR Technical Product Specification 1.12 LAN Subsystem The LAN subsystem consists of the following: • Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s) • Intel H67 Express Chipset • RJ-45 LAN connector with integrated status LEDs Additional features of the ... capabilities • LAN subsystem software For information about LAN software and drivers Refer to http://downloadcenter.intel.com 1.12.1 Intel® 82579V Gigabit Ethernet Controller The Intel 82579V Gigabit Ethernet Controller supports the following features: • 10/100/1000 BASE-T IEEE 802.3...
Product Specification
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Thermal Sensors and Fan Headers 29 Product Description 1.13.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item A B C D E Description Rear chassis fan header Thermal diode, located on the processor die Processor fan header Front chassis fan header Thermal diode, located on the Intel H67 PCH Figure 6.
Thermal Sensors and Fan Headers 29 Product Description 1.13.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item A B C D E Description Rear chassis fan header Thermal diode, located on the processor die Processor fan header Front chassis fan header Thermal diode, located on the Intel H67 PCH Figure 6.
Product Specification
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... the locations of up to 120 oC in damage to do so may result in an open chassis. Item A B C Description Processor voltage regulator area Processor Intel H67 Express Chipset Figure 15. Localized High Temperature Zones 55 Failure to the voltage regulator circuit. CAUTION Ensure that the ambient temperature does not exceed the...
... the locations of up to 120 oC in damage to do so may result in an open chassis. Item A B C Description Processor voltage regulator area Processor Intel H67 Express Chipset Figure 15. Localized High Temperature Zones 55 Failure to the voltage regulator circuit. CAUTION Ensure that the ambient temperature does not exceed the...
Product Specification
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... temperatures for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel H67 Express Chipset 111 oC To ensure functionality and reliability, the component is specified for sustained power dissipation ... For processor case temperature, see processor datasheets and processor specification updates Intel H67 Express Chipset 107 oC For information about Processor datasheets and specification updates Intel H67 Express Chipset Refer to thermal changes. Maximum case temperatures are sensitive to...
... temperatures for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel H67 Express Chipset 111 oC To ensure functionality and reliability, the component is specified for sustained power dissipation ... For processor case temperature, see processor datasheets and processor specification updates Intel H67 Express Chipset 107 oC For information about Processor datasheets and specification updates Intel H67 Express Chipset Refer to thermal changes. Maximum case temperatures are sensitive to...