Product Specification
Page 17
...-sided or double-sided DIMMs with the following generations of 2.0 Gb/s each direction per lane. Product Description 1.4.1 PCI Express x16 Graphics Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express add-in each direction per lane. The maximum theoretical bandwidth of the x16 interface is 16 GB/s in..., and 1066 MHz SDRAM DIMMs • XMP performance profile support for memory speeds above 1600 MHz • Full support for over clocking memory (see www.intel.com/support/motherboards/desktop/sb/CS-031689.htm for optimum performance. 17
...-sided or double-sided DIMMs with the following generations of 2.0 Gb/s each direction per lane. Product Description 1.4.1 PCI Express x16 Graphics Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express add-in each direction per lane. The maximum theoretical bandwidth of the x16 interface is 16 GB/s in..., and 1066 MHz SDRAM DIMMs • XMP performance profile support for memory speeds above 1600 MHz • Full support for over clocking memory (see www.intel.com/support/motherboards/desktop/sb/CS-031689.htm for optimum performance. 17
Product Specification
Page 75
Overview of BIOS Features 3.11 BIOS Performance Features The BIOS includes the following options to provide custom performance enhancements when using an Intel Core i7 and Intel Xeon processor in an LGA2011 socket. • Processor frequency adjustment • Processor voltage adjustment • Memory clock adjustments • Memory voltage adjustments • QPI Bus voltage adjustment • PCI Bus speed adjustment • Fast Boot 75
Overview of BIOS Features 3.11 BIOS Performance Features The BIOS includes the following options to provide custom performance enhancements when using an Intel Core i7 and Intel Xeon processor in an LGA2011 socket. • Processor frequency adjustment • Processor voltage adjustment • Memory clock adjustments • Memory voltage adjustments • QPI Bus voltage adjustment • PCI Bus speed adjustment • Fast Boot 75