Intel E7500 Support and Manuals
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Popular Intel E7500 Manual Pages
Design Guide - Page 3
...1.2 Definition of Terms 9
1.3 Reference Documents 10
2
Packaging Technology ...11
3
Thermal Simulation...13
4
Thermal Specifications ...15
4.1 Power ...15 4.2 Die Temperature 15
5
Thermal Metrology...17
5.1 Die Temperature Measurements 17 5.1.1 90...Solution Component Suppliers 31
Appendix B: Mechanical Drawings...33
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
3
Design Guide - Page 7
... minimizing the die to meet specified performance requirements.
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
7 Care must...
For thermal design information on other chipset components, refer to the Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and ...limits.
This document addresses thermal design and specifications for the MCH component only.
The objective...
Design Guide - Page 8
... Thermal Simulation - Mechanical Reference
Step 3: Thermal Validation -
Software Users Guide
Therm_Design_Proc
8
Intel® E7500 MCH Thermal and Mechanical Design Guidelines Thermal Reference - Figure 1 illustrates the design process implicit to the system designer. Thermal Model Users Guide
Step 2: Heatsink Selection - Introduction
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1.1
Design Flow
To develop a reliable...
Design Guide - Page 9
... array of the BGA with the reference thermal solution attached. The chipset component that contains the processor interface and the memory interface. Memory Controller Hub.
This temperature is...The chipset component that contains the primary PCI interface, LPC interface, USB, ATA-33, and other legacy functions. The chipset component that interfaces the PCI-X buses.
Intel® E7500 MCH...
Design Guide - Page 10
....intel.com/design/Xeon/guides/298348.htm Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit...
Design Guide - Page 11
... Mechanical Design Guidelines and the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet. All dimensions are in Figure 3 and Figure 2. Substrate thickness and package overall height are defined by the spherical crowns of three individual components: E7500 MCH, 82870P2 P64H2, and 82801CA ICH3-S. Packaging Technology
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2 Packaging Technology
The E7500 chipset consists of the solder...
Design Guide - Page 13
... Intel® E7500 MCH Thermal and Mechanical Design Guidelines
13
Contact your Intel Field Sales representative to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated systemlevel environment. Thermal Simulation
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3 Thermal Simulation
Intel provides thermal simulation models of the MCH and associated user's guides to order the thermal models...
Design Guide - Page 14
Thermal Simulation
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14
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
Design Guide - Page 15
...specified for one or more heatsinks when using the E7500 chipset.
4.2
Die Temperature
To ensure proper operation and reliability of the MCH, the die temperatures must be at or below the maximum temperature specifications.
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
15 Intel® E7500 MCH Thermal Specifications
Parameter
Maximum
Tdie-hs TDP
102 °C 9.0 W
NOTE...
Design Guide - Page 16
Thermal Specifications
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16
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
Design Guide - Page 17
...The hole size through thermocouple leads, or contact between the thermocouple cement and heatsink base. This contact will emulate anticipated maximum thermal design power. Intel® E7500 MCH Thermal and Mechanical Design Guidelines
17 Thermal Metrology
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5
5.1
5.1.1
Thermal Metrology
The system designer must make temperature measurements to accurately determine the thermal performance...
Design Guide - Page 18
... (0.05 in.) wide slot, 0.5 mm (0.02 in.) deep, from the centered hole to the MCH, and route thermocouple wires out through the milled slot.
18
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
Design Guide - Page 19
Figure 6. 0° Angle Attach Heatsink Modifications
Cement + Thermocouple Bead
angle_attach_1
1.3 mm (0.05 in.) (0.5 mm (0.02 in .) Depth)
Angle_Attach_Heatsink_Mod
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
19 R
Figure 5. 0° Angle Attach Methodology (Top View)
Thermocouple Wire
Thermal Metrology Die
Substrate
NOTE: Not to scale.
3.3 mm (0....
Design Guide - Page 20
... Flowchart
Start
Attach device to board using normal reflow process
Attach thermocouples using recommended methodology.
Setup
the system in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of an MCH thermal solution under these transient conditions, refer to...
Design Guide - Page 21
... level. (External-ambient refers to the environment external to the system.)
Mechanical Design Envelope
Though each design may not need thermal solutions, depending on the E7500 MCH thermal solution is assumed to be equal to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines.
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