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Mechanical Design Guidelines - Page 2

...information does not provide any features or instructions marked "reserved" or "undefined." Copies of documents which may have an order number and are trademarks of performance. Processor numbers differentiate features within its discretion to update specifications or product descriptions with information. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS...
Mechanical Design Guidelines - Page 8

... Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor...
Mechanical Design Guidelines - Page 9

..., cause logic errors or cause component and/or system damage. All of these thermal characteristics and discuss guidelines for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. Within...
Mechanical Design Guidelines - Page 10

..., the specific reference design will be referenced. Chapter 2 of this document discusses package thermal mechanical requirements to validate a processor thermal solution. Introduction 1.1.3 Document Scope This design guide supports the following processors: • Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600...
Mechanical Design Guidelines - Page 11

... total package power. TA) / Total Package Power. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for an active heatsink. Note: Heat source must be...
Mechanical Design Guidelines - Page 17

...processor, ΨCA (Refer to manage the processor TDP at an inlet temperature of the Intel reference design. The slope of the thermal profile was established assuming a generational improvement in ATX Chassis, with a fan installed... further information. Processor Case Temperature Measurement Location Measure TC at an inlet temperature of Intel Core™2 Duo processor E8000 series with...
Mechanical Design Guidelines - Page 18

... QST). The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB...
Mechanical Design Guidelines - Page 22

...Chassis Thermal Performance The heat generated by the processor and other system components out of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE...
Mechanical Design Guidelines - Page 37

... per -part basis there is greater than the thermal diode. The usage model for TCONTROL with the DTS as required with DTS. Since the DTS is factory set on -die sensor to be updated at or...is factory configured and is relevant only to TCONTROL, then TC must be maintained at each processor family. The processor uses the Digital Thermal Sensor (DTS) as the on a per sensor as below the ...
Mechanical Design Guidelines - Page 39

... BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations defined in Section 3.3. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with 1 MB cache 0.57 °C/W 0.594...
Mechanical Design Guidelines - Page 40

...Intel Core™2 Duo processor with 4 MB cache at TC-MAX of 60.1 °C the required fan speed necessary to use the fan with improved acoustics at lower fan inlet temperatures. Refer to support the processor... is to meet thermal specifications can be the acoustic limiter. 4. Note: Appendix ... installed in a BTX S2 chassis for Case 2 will be system level in Table 5-2. Intel's...
Mechanical Design Guidelines - Page 51

The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice. The E18764-001 reference design takes advantage of the cost savings for the several features of the heatsink. The overall 46 mm height thermal solution supports the ...
Mechanical Design Guidelines - Page 53

The tables also include a TA assumption of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The difference in ...
Mechanical Design Guidelines - Page 54

... 3900 2000 Thermist or Set Point Acoustic Thermal Requirements, Ψca Notes High TA = 40 °C 5.0 BA Low TA = 30 °C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB...
Mechanical Design Guidelines - Page 74

...the package within specifications published in the processor datasheet. Vendor ...Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading A.3.4.1 Motherboard...

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  • Mechanical Design Guidelines

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