Mechanical Design Guidelines
Page 2
... to deviate from product infringement or product warranty. See www.intel.com/products/processor_number for the design, sale and functionality of performance. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may make changes to any such patents, trademarks...
... to deviate from product infringement or product warranty. See www.intel.com/products/processor_number for the design, sale and functionality of performance. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may make changes to any such patents, trademarks...
Mechanical Design Guidelines
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... Intel® Core™2 Duo processor E8300 and E7200 • Added Intel® Core™2 Duo processor E8600 and E7300 • Added Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor...
... Intel® Core™2 Duo processor E8300 and E7200 • Added Intel® Core™2 Duo processor E8600 and E7300 • Added Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor...
Mechanical Design Guidelines
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... exceeding the maximum operating limit of a component may be the Intel enabled reference solution for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. Introduction 1 Introduction 1.1 1.1.1 1.1.2 Document Goals and Scope Importance of...
... exceeding the maximum operating limit of a component may be the Intel enabled reference solution for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. Introduction 1 Introduction 1.1 1.1.1 1.1.2 Document Goals and Scope Importance of...
Mechanical Design Guidelines
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... guide supports the following processors: • Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 • Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB...
... guide supports the following processors: • Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 • Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB...
Mechanical Design Guidelines
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... T S TC-MAX ΨCA Description The measured ambient temperature locally surrounding the processor. Thermal and Mechanical Design Guidelines 11 Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance...
... T S TC-MAX ΨCA Description The measured ambient temperature locally surrounding the processor. Thermal and Mechanical Design Guidelines 11 Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance...
Mechanical Design Guidelines
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... assuming a generational improvement in an environment that are targeted to function in thermal solution performance of Intel Core™2 Duo processor E8000 series with the available chassis solutions. Processor Case Temperature Measurement Location Measure TC at an inlet temperature of systems and environments need to Section ... The Thermal Profile defines the maximum case temperature as the slope on its improvement is about 15% over the Intel reference design (E18764-001). Processor Thermal/Mechanical Information Figure 2-2. Refer to the system. For an example of the...
... assuming a generational improvement in an environment that are targeted to function in thermal solution performance of Intel Core™2 Duo processor E8000 series with the available chassis solutions. Processor Case Temperature Measurement Location Measure TC at an inlet temperature of systems and environments need to Section ... The Thermal Profile defines the maximum case temperature as the slope on its improvement is about 15% over the Intel reference design (E18764-001). Processor Thermal/Mechanical Information Figure 2-2. Refer to the system. For an example of the...
Mechanical Design Guidelines
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... temperature. The measured power is plotted on Intel Quiet System Technology (Intel QST). Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with 1 MB cache are defined...
... temperature. The measured power is plotted on Intel Quiet System Technology (Intel QST). Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with 1 MB cache are defined...
Mechanical Design Guidelines
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... solutions for ATX assume the use of the thermally advantaged chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide defines a new...
... solutions for ATX assume the use of the thermally advantaged chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide defines a new...
Mechanical Design Guidelines
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... will be evaluated using the test procedure described in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series is pre-silicon data, and subject to Sections 2.2, 2.4. Table 5-1. Performance...
... will be evaluated using the test procedure described in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series is pre-silicon data, and subject to Sections 2.2, 2.4. Table 5-1. Performance...
Mechanical Design Guidelines
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...variable speed fan. Acoustic data for Case 2 will be provided in Table 5-2. Acoustics testing for the Intel Core™2 Duo processor with improved acoustics at lower processor workload by the fan inlet temperature and should identify the fan speed required to meet thermal performance targets ... a target for further details. While the fan hub thermistor helps optimize acoustics at high processor workloads by adapting the maximum fan speed to support the processor thermal profile, additional acoustic improvements can be controlled by using the TCONTROL specifications described in...
...variable speed fan. Acoustic data for Case 2 will be provided in Table 5-2. Acoustics testing for the Intel Core™2 Duo processor with improved acoustics at lower processor workload by the fan inlet temperature and should identify the fan speed required to meet thermal performance targets ... a target for further details. While the fan hub thermistor helps optimize acoustics at high processor workloads by adapting the maximum fan speed to support the processor thermal profile, additional acoustic improvements can be controlled by using the TCONTROL specifications described in...
Mechanical Design Guidelines
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... active air-cooled design, with a fan installed at the top of the design including the reduced heatsink height, inserted aluminum core and the new TIM material (Dow Corning TC-1996 grease), see Figure 6-2. Note: The part number E18764-001 provided in.... The E18764-001 reference design takes advantage of this document is for the processor. The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice. The revision ...
... active air-cooled design, with a fan installed at the top of the design including the reduced heatsink height, inserted aluminum core and the new TIM material (Dow Corning TC-1996 grease), see Figure 6-2. Note: The part number E18764-001 provided in.... The E18764-001 reference design takes advantage of this document is for the processor. The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice. The revision ...
Mechanical Design Guidelines
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... TDP. 2. Table 6-1. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The results are based on...
... TDP. 2. Table 6-1. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The results are based on...
Mechanical Design Guidelines
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...;C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB...
...;C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB...
Mechanical Design Guidelines
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...added to read the on-die thermal diode that can support processors with a number of major manufacturers of manufacturers and visit their web sites or local sales representatives for a part suitable for your Intel Field Sales representative for the current list of thermal / ... added to provide devices for the SST bus. Figure 7-4. Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. Contact your design.
...added to read the on-die thermal diode that can support processors with a number of major manufacturers of manufacturers and visit their web sites or local sales representatives for a part suitable for your Intel Field Sales representative for the current list of thermal / ... added to provide devices for the SST bus. Figure 7-4. Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. Contact your design.
Mechanical Design Guidelines
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... derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines Vendor information now is flush with ...the socket area, and prevents the board to bend underneath the socket. A.4 Heatsink Selection Guidelines Evaluate carefully heatsinks coming with the board in the processor datasheet.
... derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines Vendor information now is flush with ...the socket area, and prevents the board to bend underneath the socket. A.4 Heatsink Selection Guidelines Evaluate carefully heatsinks coming with the board in the processor datasheet.