Intel BX80570E8400 - Core 2 Duo 3 GHz Processor Support and Manuals
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Mechanical Design Guidelines - Page 2
... or errors known as the property of the information provided. Intel provides this document, or other features, and increments are referenced in any liability arising from published specifications. Current characterized errata are trademarks of any features or instructions marked "reserved" or "undefined." Intel, Pentium, Intel Core, Celeron, Intel Inside, and the Intel logo...
Mechanical Design Guidelines - Page 10
...1.1.3
Document Scope
This design guide supports the following processors:
• Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190
• Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300...
Mechanical Design Guidelines - Page 11
... when reading this document. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet
LGA775 Socket Mechanical Design Guide
uATX SFF Design Guidance Fan Specification for an active heatsink.
This is usually measured at...
Mechanical Design Guidelines - Page 14
...Package movement during their respective stress conditions. Refer to the LGA775 Socket Mechanical Design Guide for the thermal solution of interest should be exceeded during socket actuation is necessary to ensure mechanical performance, it should not exceed the processor datasheet compressive dynamic load specification during a mechanical shock event. The total combination of dynamic and...
Mechanical Design Guidelines - Page 17
... solution performance of the heatsink attached to the processor, ΨCA (Refer to manage the processor TDP at an inlet temperature of processor power dissipation. This performance...35 °C ambient temperature external to manage the processor TDP at an inlet temperature of Intel Core™2 Duo processor E8000 series with a fan installed at this point
(geometric center of the package)...
Mechanical Design Guidelines - Page 37
... set ...: The processor has only DTS and no need for the measured power dissipation. The digital thermal sensor is easier to be updated at or...to TCONTROL, then TC must be maintained at each processor family. The usage model for TCONTROL with the DTS as below the Thermal ... the package without adding a pair of signal pins per -part basis there is no thermal diode. The DTS TCONTROL value ...
Mechanical Design Guidelines - Page 40
... acoustics at high processor workloads by using the TCONTROL specifications described in a BTX S2 chassis for the Intel Core™2 Duo processor with improved acoustics at lower processor workload by adapting the maximum fan speed to meet thermal specifications can be achieved at lower fan inlet temperatures. Acoustic Targets
Fan Speed RPM
Thermistor Set Point
Acoustic
Thermal...
Mechanical Design Guidelines - Page 43
...performance and higher surface temperatures.
Reference Heatsink Thermal Validation
The Intel reference heatsink will be validated within the specific boundary conditions based on the thermal test...outlined here may differ from your own system requirements.
The system designer needs to account for the processor
C
is done in the overall system thermal design to 500 Hz @ 0.01 g2/Hz (flat...
Mechanical Design Guidelines - Page 53
... Thermal Performance, Ψca (Mean + 3σ)
Assum TAption
Notes
Intel Core™2 Duo processor E8000 series with 6 MB cache
Intel Core™2 Duo processor E7000 series with 3 MB cache / Intel Pentium dual-core processor E6000, E5000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The difference in Section 6.2.4.
ATX Thermal/Mechanical...
Mechanical Design Guidelines - Page 54
... Reference Heatsink (E18764-001)
Fan Speed RPM
3900
2000
Thermist or Set Point
Acoustic
Thermal Requirements, Ψca
Notes
High TA = 40 °C
5.0 BA
Low TA = 30 °C
3.5 BA
• 0.50° C/W (Core™2 Duo processor E8000 series 6 MB)
• 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel®...
Mechanical Design Guidelines - Page 67
... implementation that is in all of manufacturers and visit their web sites or local sales representatives for a part suitable for your Intel Field Sales representative for the current list of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the proper configuration information, the ME can be added to monitor system...
Mechanical Design Guidelines - Page 68
... modified to meet the thermal profile of the processor. Figure 7-5.
Operating
Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for availability of these tools.
7.4
Fan Hub Thermistor and Intel® QST
There is the responsibility of the board manufacturer. Intel QST, by design provides a ΨCA sufficient to...
Mechanical Design Guidelines - Page 70
...to matching a target MB deflection. Board Deflection Configuration Definitions
Configuration Parameter
Processor + Socket load plate
Heatsink
d_ref
yes
no
d_BOL
yes
yes
d_EOL
yes
yes
NOTES: BOL:...preload EOL deflection
70
Thermal and Mechanical Design Guidelines Therefore, the heatsink preload for LGA775 socket solder joint protection against fatigue failure can be used.
Height...
Mechanical Design Guidelines - Page 73
...Guidelines
73 LGA775 Socket Heatsink Loading Figure 7-7.
As a result, designs could see as much as 0.22 mm
As a result, the board should not exceed motherboard manufacturer specifications. NOTES...clip/fastener assembly. Example-Defining Heatsink Preload Meeting Board Deflection Limit
A.3.4
Additional Considerations
Intel recommends to design to processor datasheet). 2. d_ref = 0.15 mm} at ...
Mechanical Design Guidelines - Page 74
...processor datasheet.
A.4
Heatsink Selection Guidelines
Evaluate carefully heatsinks coming with the board in the socket area, and prevents the board to bend underneath the socket. LGA775 Socket Heatsink Loading
A.3.4.1
Motherboard Stiffening Considerations
To protect LGA775... within specifications published in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go...
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