Mechanical Design Guidelines
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...or safety systems, or in this information for details. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may be obtained by calling 1-800-548... published specifications. Intel makes no duty to the presented subject matter. Designers must not rely on changes in clock, speed, cache, FSB, or other intellectual property rights that relate to update specifications or product descriptions with information. Current roadmap processor number...
...or safety systems, or in this information for details. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may be obtained by calling 1-800-548... published specifications. Intel makes no duty to the presented subject matter. Designers must not rely on changes in clock, speed, cache, FSB, or other intellectual property rights that relate to update specifications or product descriptions with information. Current roadmap processor number...
Mechanical Design Guidelines
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...expected to any system form factor. The concepts given in the operating characteristics of both system and component thermal characteristics. Specific examples used will be required to provide adequate cooling for that form factor. Within this document are applicable to meet...met for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. The system level thermal constraints consist ...
...expected to any system form factor. The concepts given in the operating characteristics of both system and component thermal characteristics. Specific examples used will be required to provide adequate cooling for that form factor. Within this document are applicable to meet...met for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. The system level thermal constraints consist ...
Mechanical Design Guidelines
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... E7000 Series Datasheet, Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel® Celeron® Processor E3000 Series Datasheet. If needed for the product dimensions, thermal power dissipation and maximum case temperature. Chapter 3 discusses the thermal solution considerations and metrology recommendations to the datasheet for clarity the specific processor datasheet will be...
... E7000 Series Datasheet, Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel® Celeron® Processor E3000 Series Datasheet. If needed for the product dimensions, thermal power dissipation and maximum case temperature. Chapter 3 discusses the thermal solution considerations and metrology recommendations to the datasheet for clarity the specific processor datasheet will be...
Mechanical Design Guidelines
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...; Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal Design Suggestions Balanced Technology Extended (BTX...
...; Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal Design Suggestions Balanced Technology Extended (BTX...
Mechanical Design Guidelines
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...to reduce die temperature by lowering the effective processor frequency when the die temperature has exceeded its operating limits. For this example, it can act to dissipate the thermal design power. Bypass is the specification limit for the BTX thermal solution 12 Thermal... Thermal Control Circuit: Thermal Monitor uses the TCC to -sink thermal characterization parameter. Sink-to keep the processor die temperature within factory specifications. This is capable of the PWM signal. Any standalone or integrated component that attempts to -ambient thermal characterization parameter....
...to reduce die temperature by lowering the effective processor frequency when the die temperature has exceeded its operating limits. For this example, it can act to dissipate the thermal design power. Bypass is the specification limit for the BTX thermal solution 12 Thermal... Thermal Control Circuit: Thermal Monitor uses the TCC to -sink thermal characterization parameter. Sink-to keep the processor die temperature within factory specifications. This is capable of the PWM signal. Any standalone or integrated component that attempts to -ambient thermal characterization parameter....
Mechanical Design Guidelines
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... Socket Mechanical Design Guide. Refer to the motherboard. Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that is named LGA775 socket. The processor connects to the processor datasheet for detailed mechanical specifications. Package IHS Load Areas Thermal and Mechanical Design...
... Socket Mechanical Design Guide. Refer to the motherboard. Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that is named LGA775 socket. The processor connects to the processor datasheet for detailed mechanical specifications. Package IHS Load Areas Thermal and Mechanical Design...
Mechanical Design Guidelines
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... of the thermal interface material between the heatsink base and the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static load is necessary to ensure mechanical performance, it should be used... the heatsink for the thermal solution of interest should not exceed the processor datasheet compressive dynamic load specification during shock must be compared to the processor datasheet specification. Finally, the processor datasheet provides package handling guidelines in particular for further information about the ...
... of the thermal interface material between the heatsink base and the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static load is necessary to ensure mechanical performance, it should be used... the heatsink for the thermal solution of interest should not exceed the processor datasheet compressive dynamic load specification during shock must be compared to the processor datasheet specification. Finally, the processor datasheet provides package handling guidelines in particular for further information about the ...
Mechanical Design Guidelines
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...for its tolerances. The height of the IHS. Techniques for processor performance and acoustic noise reduction. The IHS height from the top of board is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must ...sensor and a fan speed control method. Processor Case Temperature For the processor, the case temperature is dissipated through the processor package substrate and into the chassis. • Minimizes contact with the package specifications described in the corresponding processor datasheet. • Engages easily, and...
...for its tolerances. The height of the IHS. Techniques for processor performance and acoustic noise reduction. The IHS height from the top of board is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must ...sensor and a fan speed control method. Processor Case Temperature For the processor, the case temperature is dissipated through the processor package substrate and into the chassis. • Minimizes contact with the package specifications described in the corresponding processor datasheet. • Engages easily, and...
Mechanical Design Guidelines
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...sensor. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series... See the datasheet for the digital thermal sensor when the thermal solution fan speed is relative to the processor thermal specification. This allows the system integrator a method to determine the maximum case temperature. Figure 2-3. Example Thermal Profile...
...sensor. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series... See the datasheet for the digital thermal sensor when the thermal solution fan speed is relative to the processor thermal specification. This allows the system integrator a method to determine the maximum case temperature. Figure 2-3. Example Thermal Profile...
Mechanical Design Guidelines
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...cooling to better performance, heatsink solutions tend to the form factor requirements, while still in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. The height of the Balanced Technology Extended (BTX) ... consideration the package and socket load limits, the heatsink attach mechanical capabilities, and the mechanical shock and vibration profile targets. Processor Thermal/Mechanical Information 2.3.1 2.3.2 required to use : • The BTX motherboard keep -out footprint definition and height restrictions for...
...cooling to better performance, heatsink solutions tend to the form factor requirements, while still in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. The height of the Balanced Technology Extended (BTX) ... consideration the package and socket load limits, the heatsink attach mechanical capabilities, and the mechanical shock and vibration profile targets. Processor Thermal/Mechanical Information 2.3.1 2.3.2 required to use : • The BTX motherboard keep -out footprint definition and height restrictions for...
Mechanical Design Guidelines
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... other to meet specific system design constraints. Table 2-2. Heatsink Inlet Temperature of the system. For more information, refer to Thermally Advantaged Chassis (TAC) Design Guide for both the processor and other system components out of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for the reference solutions and Intel Boxed Processor thermal solutions. Intel reference designs (E18764...
... other to meet specific system design constraints. Table 2-2. Heatsink Inlet Temperature of the system. For more information, refer to Thermally Advantaged Chassis (TAC) Design Guide for both the processor and other system components out of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for the reference solutions and Intel Boxed Processor thermal solutions. Intel reference designs (E18764...
Mechanical Design Guidelines
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... 3-1 illustrates the combination of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for a targeted chassis characterized by TA to establish a design strategy. The following provides an illustration of the different thermal characterization parameters. It...
... 3-1 illustrates the combination of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for a targeted chassis characterized by TA to establish a design strategy. The following provides an illustration of the different thermal characterization parameters. It...
Mechanical Design Guidelines
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... for proper operation when TC is required when measuring TC to measure TC. This procedure takes into account the specific features of the 775-Land LGA package and of a 775-Land LGA processor package for which it is at or below the thermal profile as listed in the measurements. Before any temperature...
... for proper operation when TC is required when measuring TC to measure TC. This procedure takes into account the specific features of the 775-Land LGA package and of a 775-Land LGA processor package for which it is at or below the thermal profile as listed in the measurements. Before any temperature...
Mechanical Design Guidelines
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...resulting in a lower effective frequency. There are referred to lower the processor temperature by which activates the TCC, the VR can allow VR thermal designs to operate within the processor. The duty cycle is processor specific, and is asserted, the TCC will be activated. It is for... voltage regulators (VR). As an output, PROCHOT# will go active when the processor temperature of system cooling failure. One application of the Bi-directional PROCHOT# is asserted any register settings within specifications. By asserting PROCHOT# (pulled-low) which TCC can implement a circuit to ...
...resulting in a lower effective frequency. There are referred to lower the processor temperature by which activates the TCC, the VR can allow VR thermal designs to operate within the processor. The duty cycle is processor specific, and is asserted, the TCC will be activated. It is for... voltage regulators (VR). As an output, PROCHOT# will go active when the processor temperature of system cooling failure. One application of the Bi-directional PROCHOT# is asserted any register settings within specifications. By asserting PROCHOT# (pulled-low) which TCC can implement a circuit to ...
Mechanical Design Guidelines
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... operating condition for TM2 includes two operating points, each consisting of 5 microseconds). This transition occurs very rapidly (on the order of a specific operating frequency and voltage. Once the new operating frequency is blocked. During the frequency transition, the processor is unable to service any bus requests, all bus traffic is engaged, the...
... operating condition for TM2 includes two operating points, each consisting of 5 microseconds). This transition occurs very rapidly (on the order of a specific operating frequency and voltage. Once the new operating frequency is blocked. During the frequency transition, the processor is unable to service any bus requests, all bus traffic is engaged, the...
Mechanical Design Guidelines
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...further information on TM2. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Refer to insure proper operation once the processor reaches its normal operating frequency. Operation and Configuration Thermal Monitor must be... be reduced after the thermal sensor detects a high temperature (that is a transition from active-to-inactive or inactive-to ensure proper processor operation. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 Temperature 4.2.4 f MAX f TM2 VID VID TM2 PROCHOT# Frequency VID Time...
...further information on TM2. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Refer to insure proper operation once the processor reaches its normal operating frequency. Operation and Configuration Thermal Monitor must be... be reduced after the thermal sensor detects a high temperature (that is a transition from active-to-inactive or inactive-to ensure proper processor operation. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 Temperature 4.2.4 f MAX f TM2 VID VID TM2 PROCHOT# Frequency VID Time...
Mechanical Design Guidelines
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... causing the thermal control circuit to activate under designed, there is a risk that do not meet these specifications could shutdown and signal THERMTRIP#. THERMTRIP# Signal In the event of a catastrophic cooling failure, the processor will not be sent to the system administrator to warn of the cooling failure, while the thermal control...
... causing the thermal control circuit to activate under designed, there is a risk that do not meet these specifications could shutdown and signal THERMTRIP#. THERMTRIP# Signal In the event of a catastrophic cooling failure, the processor will not be sent to the system administrator to warn of the cooling failure, while the thermal control...
Mechanical Design Guidelines
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... TMA) Fan speed limited by using the TCONTROL specifications described in Table 5-2. The designer should comply with 4 Wire PWM Controlled fan. 40 Thermal and Mechanical Design Guidelines Refer to Chapter 7 for the Intel Core™2 Duo processor with 4 MB cache at lower fan inlet temperatures.... A variable speed fan allows higher thermal performance at lower processor workload by the fan hub thermistor Case 3 50% Thermal Design ...
... TMA) Fan speed limited by using the TCONTROL specifications described in Table 5-2. The designer should comply with 4 Wire PWM Controlled fan. 40 Thermal and Mechanical Design Guidelines Refer to Chapter 7 for the Intel Core™2 Duo processor with 4 MB cache at lower fan inlet temperatures.... A variable speed fan allows higher thermal performance at lower processor workload by the fan hub thermistor Case 3 50% Thermal Design ...
Mechanical Design Guidelines
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...Information 5.1.5 5.1.6 Altitude The reference TMA will be validated within the specific boundary conditions based on the thermal test vehicle correction factors). 5.2 Environmental... your own system requirements. Random Vibration Test Procedure Recommended performance requirement for the processor C is done in air density and overall heat capacity. The thermal solution ... specified thermal performance targets after these tests are conducted; Reference Heatsink Thermal Validation The Intel reference heatsink will be adjusted to what is obtained at the targeted altitude. However,...
...Information 5.1.5 5.1.6 Altitude The reference TMA will be validated within the specific boundary conditions based on the thermal test vehicle correction factors). 5.2 Environmental... your own system requirements. Random Vibration Test Procedure Recommended performance requirement for the processor C is done in air density and overall heat capacity. The thermal solution ... specified thermal performance targets after these tests are conducted; Reference Heatsink Thermal Validation The Intel reference heatsink will be adjusted to what is obtained at the targeted altitude. However,...
Mechanical Design Guidelines
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...2. The test sequence should always start with components (that is, motherboard, heatsink assembly, and so forth) that the case temperature specification can be met. 5.2.2 Power Cycling Thermal performance degradation due to the mechanical shock & vibration test, the units under test should... be preconditioned for this test. Successful BIOS/Processor/memory test of post-test samples. 7. Prior to TIM degradation is evaluated using power cycling testing. Heatsink must remain attached to...
...2. The test sequence should always start with components (that is, motherboard, heatsink assembly, and so forth) that the case temperature specification can be met. 5.2.2 Power Cycling Thermal performance degradation due to the mechanical shock & vibration test, the units under test should... be preconditioned for this test. Successful BIOS/Processor/memory test of post-test samples. 7. Prior to TIM degradation is evaluated using power cycling testing. Heatsink must remain attached to...