Mechanical Design Guidelines
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... patents or pending patent applications, trademarks, copyrights, or other intellectual property rights. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may make changes to them. Intel accepts no duty to represent proportional or quantitative increases in this information for...
... patents or pending patent applications, trademarks, copyrights, or other intellectual property rights. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may make changes to them. Intel accepts no duty to represent proportional or quantitative increases in this information for...
Mechanical Design Guidelines
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... Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor E7600 • Added Intel® Pentium dual-core processor E6500 • Intel® Celeron® processor E3x00 series • Added Intel® Pentium dual-core processor E6600 • Intel...
... Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor E7600 • Added Intel® Pentium dual-core processor E6500 • Intel® Celeron® processor E3x00 series • Added Intel® Pentium dual-core processor E6600 • Intel...
Mechanical Design Guidelines
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... of the local ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. Thermal and Mechanical Design Guidelines 9 Document Goals Depending on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series.
... of the local ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. Thermal and Mechanical Design Guidelines 9 Document Goals Depending on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series.
Mechanical Design Guidelines
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...; Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 • Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB cache applies to Intel® Pentium® dual-core processors...
...; Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 • Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB cache applies to Intel® Pentium® dual-core processors...
Mechanical Design Guidelines
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Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal ...
Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal ...
Mechanical Design Guidelines
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... to the system. The slope of the thermal profile was established assuming a generational improvement in ATX Chassis, with a fan installed at an inlet temperature of Intel Core™2 Duo processor E8000 series with the available chassis solutions. For an example of 35 °C + 0.5 °C = 35.5 °C. For ATX platforms, an active air-cooled design...
... to the system. The slope of the thermal profile was established assuming a generational improvement in ATX Chassis, with a fan installed at an inlet temperature of Intel Core™2 Duo processor E8000 series with the available chassis solutions. For an example of 35 °C + 0.5 °C = 35.5 °C. For ATX platforms, an active air-cooled design...
Mechanical Design Guidelines
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... to reduce the acoustic noise of TCONTROL is the processor idle power. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with lower value (farther from 0, such...
... to reduce the acoustic noise of TCONTROL is the processor idle power. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with lower value (farther from 0, such...
Mechanical Design Guidelines
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The following tables show the TA requirements for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide defines a new processor cooling solution inlet temperature target of 40 °C. The existing TAC 1.1 chassis can be...
The following tables show the TA requirements for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide defines a new processor cooling solution inlet temperature target of 40 °C. The existing TAC 1.1 chassis can be...
Mechanical Design Guidelines
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... (BTX) Type II Reference TMA Performance Processor Thermal Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed in Section...
... (BTX) Type II Reference TMA Performance Processor Thermal Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed in Section...
Mechanical Design Guidelines
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Using the example in Table 5-2 for the Intel Core™2 Duo processor with 4 MB cache at TC-MAX of 60.1 °C the required fan speed necessary to implement fan speed control capability based the digital thermal sensor...Thermal Design Power TMA Only Case 3 50% Thermal Design Power System (PSU, HDD, TMA) NOTES: 1. Intel's recommendation is not a target for Case 1 and 3. 3. Table 5-2. Acoustic data for the Intel reference thermal solutions with improved acoustics at lower processor workload by the fan heatsink assembly, the Type II reference design implements a variable speed fan...
Using the example in Table 5-2 for the Intel Core™2 Duo processor with 4 MB cache at TC-MAX of 60.1 °C the required fan speed necessary to implement fan speed control capability based the digital thermal sensor...Thermal Design Power TMA Only Case 3 50% Thermal Design Power System (PSU, HDD, TMA) NOTES: 1. Intel's recommendation is not a target for Case 1 and 3. 3. Table 5-2. Acoustic data for the Intel reference thermal solutions with improved acoustics at lower processor workload by the fan heatsink assembly, the Type II reference design implements a variable speed fan...
Mechanical Design Guidelines
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...Corning TC-1996 grease), see uATX SFF Guidance for additional details on uATX SFF design. The thermal technology required for the processor. Note: The part number E18764-001 provided in the Table 6-2). The overall 46 mm height thermal solution supports the unique ...reference only. The revision number -001 may be subject to the E18764-001 reference design; The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice.
...Corning TC-1996 grease), see uATX SFF Guidance for additional details on uATX SFF design. The thermal technology required for the processor. Note: The part number E18764-001 provided in the Table 6-2). The overall 46 mm height thermal solution supports the unique ...reference only. The revision number -001 may be subject to the E18764-001 reference design; The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice.
Mechanical Design Guidelines
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... processors of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor...
... processors of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor...
Mechanical Design Guidelines
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... °C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and...
... °C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and...
Mechanical Design Guidelines
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...0 for BTX recommendations for placement). Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the proper configuration information, ...the ME can be added to provide devices for the SST bus. Contact your Intel Field Sales representative for the ...
...0 for BTX recommendations for placement). Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the proper configuration information, ...the ME can be added to provide devices for the SST bus. Contact your Intel Field Sales representative for the ...
Mechanical Design Guidelines
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... Solutions derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in some situations like backing plates), and conduct board deflection assessments based on the...stiffening devices (like : • Board bending during mechanical shock event. • Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines
... Solutions derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in some situations like backing plates), and conduct board deflection assessments based on the...stiffening devices (like : • Board bending during mechanical shock event. • Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines